UK innovation center CPI is contributing its facilities to an EU project focused on researching lightweight embedded electronics.
The LEE-BED project will reportedly run for four years with a consortium funding value of over €10 million. It aims to boost the development and manufacture of nanomaterials, inks, adhesives, composites and lightweight embedded electronics for European industry.
‘The LEE-BED innovation test bed will have a huge impact on businesses across the nanomaterials, formulation and embedded electronics industries in Europe,’ said John Cocker, director of electronics at CPI, said. ‘The benefits of the cost-effective and accelerated development of sensors and electronic components will have a number of applications in the IoT, wearable electronics, automotive, construction and energy industries.’
This story uses material from CPI, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.
