According to market analysts IDTechEx, the market for 3D electronics could reach US$3 billion by 2030.
The report suggests that electrical circuits are increasingly being added onto 3D surfaces and integrated within objects using a range of new techniques such as aerosol and material jetting, in-mold electronics and 3D printing.
‘With 3D electronics, adding electronic functionality no longer requires incorporating a rigid, planar PCB [printed circuit board] into an object then wiring up the relevant switches, sensors, power sources and other external components,’ the report suggests.
The report entitled ‘3D Electronics 2020-2030: Technologies, Forecasts, Players’ can be accessed here.
This story uses material from IDTechEx, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.
