Boeing to develop AM standardization

Boeing and engineering company Oerlikon have signed a five-year collaboration agreement to develop standard materials and processes for metal-based additive manufacturing (AM). ‘This agreement is an important step toward fully unlocking the value of powder bed titanium additive manufacturing for the aerospace industry,’ said Leo Christodoulou, Boeing chief technologist. ‘Boeing and Oerlikon will work together to standardize additive manufacturing operations from powder management to finished product and thus enable the development of a wide range of safe, reliable and cost-effective structural titanium aerospace components.’ ‘This program will drive the faster adoption of additive manufacturing in the rapidly growing aerospace, space and defence markets,’ said D. Roland Fischer, CEO Oerlikon Group. ‘Working together with Boeing will define the path in producing airworthy additive manufacturing components for serial manufacturing. We see collaboration as a key enabler to unlocking the value that additive manufacturing can bring to aircraft platforms and look forward to partnering with Boeing.’ Boeing and Oerlikon will use the data from this collaboration to support the qualification of additive manufacturing suppliers to produce metallic components using a variety of machines and materials. The research will initially focus on industrializing titanium powder bed fusion additive manufacturing and ensuring parts made with this process meet the flight requirements of the Federal Aviation Administration and Department of Defence. The collaboration between Boeing and Oerlikon could help the companies meet the current challenges to qualify materials and processes for aerospace and provide a route for the adoption of additive manufacturing with a qualified supply chain that achieves quality and cost targets.

This story is reprinted from material from Oerlikon, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.